Advances in Digitally-Modulated Load-Pull Analysis and PCB Design Flows for Basestation Power Amplifiers

Modern modulation schemes have high peak to average power ratios (PAPR) that can drive a power amplifier deep into saturation leading to distortion that results in spectral spreading of the signal causing adjacent channel interference. The linearity/efficiency problem can be overcome with a variety of methods including the use of high compression-point PAs, amplifier linearization techniques and proper impedance matching as determined through load-pull analysis.

Load pull analysis sweeps the impedance presented to a device, measuring performance, and plotting the resultant performance contours. Recently EDA tools have added capabilities to deal with complex sets of load pull data. This presentation shows how these new features support digitally-modulated communication measurements such as ACPR, EVM and BER can be contoured, to provide further impedance optimization and provide insight to the impact of varying load conditions.

Presenter Bio:

Andy Hughes is a Solutions Architect with NI, AWR Group. He works with current and potential customers to provide guidance and assistance with NI/AWR's EDA software in modelling their advanced Microwave & RF circuit and system designs. The role requires in-depth understanding of passive and active circuits, design flows, and the capabilities of linear, nonlinear, EM simulation, and system simulation tools. Through 30 years working in many disciplines of RF & Microwave design, plus programming experience, Andy has considerable understanding of product development, the techniques used in RF/microwave design, and how to best exploit EDA software to produce accurate simulations and reduce re-work and time to market. Andy received his Bachelor of Science degree in Electronic Engineering from University of Leeds in 1984. He has held various engineering and engineering manager roles including Marconi, and Cobham Tactical Communications & Surveillance, before joining AWR in 2013.