Highly Integrated Silicon ICs – A Disruptive Technology for Phased Arrays

Sponsored by: Richardson Electronics and Anokiwave

Description:
Active electronically scanned array (AESA) antennas are being adopted for a wide range of commercial and military markets. The industry is seeing increasing use of silicon based technologies (SiGe BiCMOS and RF CMOS) to provide increased functional density and capability within a single die/package. This webinar reviews basic AESA principles and identifies some of the technical challenges of building high density planar phased arrays. It suggests that solutions to these problems can be found by greatly increasing the level of integration in the IC solutions, thus enabling large-scale planar AESAs. Examples will be discussed of the performance features than can be embedded into highly integrated ASICs used in silicon based AESAs.