RF PCB Design Verification and Flows

To support ever-increasing functionality, printed circuit boards (PCBs) are employing more complex board structures operating at high-frequencies. In this webinar, Dr. Dunn will examine changing EM verification requirements for PCBs targeting RF/wireless applications and recent capabilities in the PCB import wizard that enable designers to isolate and characterize critical traces through complex multi-layer configurations.

Presenter Bio:
Dr. John Dunn, a recognized expert in EM modeling and simulation for high-frequency and high-speed circuit applications, is a senior applications engineer at NI (Formerly AWR Corp.) and develops and presents NI AWR software training material to customers worldwide. Before joining AWR Group, he was head of the interconnect modeling group at Tektronix and a professor of electrical engineering at the University of Colorado, Boulder, where he led a research group in EM simulation and modeling. Dr. Dunn received his Ph.D. and M.S. degrees in applied physics from Harvard University and is a senior member of IEEE.