Virtual Antenna(TM) Matching-Circuit Design and Integration for IoT Devices

This webinar presents a new technology and design methodology that enables one antenna component from Fractus Antennas to fit all internet of things (IoT) designs based on a new generation of tiny components called antenna boosters. To address IoT applications, this miniature, multipurpose, surface-mount technology (SMT) component fits seamlessly in an electronic printed circuit board (PCB) the same way as any other electronic component, replacing conventional customized antennas for wireless applications. The miniature boosters are also multi-band, so they easily work to any standard or frequency (NB-IoT, LoRa, Sigfox, WiFi, GPS, 4G, 3G…), even multiple standards simultaneously.

The input impedance of these devices can be designed for any frequency using NI AWR Design Environment impedance matching-network synthesis within Microwave Office circuit simulation software. They can be assembled in production on the main PCB using conventional pick-and-place machinery, resulting in a lower production cost and improved quality and reliability. Even though they are much smaller than the operating wavelength, the antenna boosters still provide full functional multi-band wireless connectivity to smartphones and IoT devices.

Presenter Bio:
Dr. Jaume Anguera is the chief scientist at Fractus Antennas, the lead inventor of the Virtual Antenna technology, and an associate professor at University Ramon LLull, Barcelona, Spain. He was the R&D manager at Fractus from 1999 to 2017 and also worked in South Korea designing antennas for the mobile industry for Samsung and LG. Anguera is an inventor with over 140 granted patents, many of them licensed, and an author of over 220 scientific papers. He has twenty years of experience in industrial antenna design for wireless devices.