Improving On-Wafer Measurements and Device Characterization Accuracy

As communication and wireless frequencies migrate into the millimeter-wave, on-wafer measurements need to span into the upper mmWave frequencies for accurate device characterization. When developing these systems, it is important to characterize the devices over a much broader range of frequencies, from near-DC to well beyond the operating frequency, in order to provide as accurate a model as possible. Wider frequency sweeps optimize the chance for accurate models, which provide accurate simulations and the opportunity to reduce design turns.

During this webinar, you will learn more about new techniques enabling single-sweep measurements in to the upper mmWave frequency ranges, as well as the innovative technologies behind them that are enabling these measurements, helping improve first-turn design success, and improving time-to-market.

Who should attend:

• Design Engineer who need to characterize their devices to extremely high frequencies (220 GHz) for improved device modeling in order to improve chances for first turn design success and faster time to market.
• Device modelers responsible for creating accurate models for circuit simulators.
• Anyone requiring broadband mmWave systems that operate to 220 GHz.

What you will learn how to :

• Leverage new solutions to enable efficient and cost-effective device characterization to 220 GHz
• Reduce concatenation errors that narrowband waveguide technologies can be prone to
• Improve first-turn design success and time-to-market
• Reduce design cost