Don’t Forget Temperature as an Important Design Criterion
High Frequency Electronics
- Author:
Pengelly, Janke, Fejzuli, Kaarsberg and Roldan
Two articles in this issue have a strong emphasis on thermal performance. The article by Pengelly and Janke on a silicon carbide wideband amplifier notes that the high junction temperature capability of SiC devices allows the high quiescent currents required for these amplifiers. This allows an amplifier to be designed without using larger (and more expensive) power devices that must be operated well below their maximum ratings. The article by Fejzuli, Kaarsberg and Roldan describes a device specifically designed to combine fre-quency and thermal equalization characteristics to maintain consistent amplifier gain over bandwidth and temperature.
Please note:
By downloading a white paper, the details of your profile might be shared with the creator of the content and you may be contacted by them directly.
