This White Paper outlines methods for proper handling, component placement, optimum attachment methods, and interconnect techniques for use with GaN and GaAs microwave monolithic integrated circuits (MMICs) in electronic assemblies.
Note that GaAs and GaN MMICs are sensitive to electrostatic discharge (ESD). Precautions should be taken with properly grounding equipment, environment, workstations, and operators to minimize/eliminate ESD during die handling, assembling, and packaging. Operators should wear proper ESD grounding straps. Test and assembly equipment and stations should be properly grounded and periodically tested for ESD compliance.
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