System on Chip (SoC) implementations with integrated data converters and RF front-end subsystems are being deployed in 5G/6G, phased array radar, SATCOM, FPGA cards, and test & measurement architectures. This paper describes the research,development, simulation, and measurements performed in a project to design the optimal breakout region (BOR) for the use of array connectors that simultaneously carry analog, digital, and/or power signals in an RF environment, as a replacement for traditional compression mount and threaded PCB connectors for RF signals.
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