Developments in Packaging: RFIC, MMIC, LTCC, SiP, SoC
High Frequency Electronics
The first step in the process occurred many years ago with the evolution of integrated circuits from dualinline packages (DIP) to SOIC, SSOP, TSSOP, etc. As surface-mount technology grew in popularity, numerous proprietary packaging options were developed for functional modules—mixers, oscillators, couplers, etc. Many of these modules are still in existence, but have been shrunk to the point where they are no longer “modules” but can be treated as individual SMT components.
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