The rapid growth of smart devices, mobile-to-mobile connected modules and the ever increasing amounts of data and voice traffic generated by their use are key drivers in the need to expand the global network and transmission capacity.
SABIC has developed new solutions to help manufacturers of base station antennas – in particular, internal components such as phase shifters - meet this demand, with a new portfolio of THERMOCOMP compounds that have been engineered to meet specific performance requirements in ways that are superior to two incumbent materials, ceramics and PCBs.
This suite of new materials has been optimized for transmission conditions from 900 MHz to 3 GHz and beyond, providing different combinations of Dk (dielectric constant) and Df (dielectric dissipation factor) performance. In general, when compared to ceramics and PCBs, SABIC’s materials can provide a better balance of dielectric properties, with extremely low Df, down to 0.001, and a wide range of Dk from 3 to 13.9, depending on frequency requirements. By comparison, general purpose PCBs are capable of Df to 0.005.
Within each base station are multiple antennas containing phase shifters which, based on traffic, deliver either greater strength which results in fewer dropped transmissions; greater range which results in broader coverage area; or both. Key measures of performance are the dielectric constant (Dk), which quantifies signal range, and the dielectric dissipation factor (Df), which indicates signal loss. The dielectric performance requirements are slightly different at various frequencies from 900 MHz to 3GHz, and at different temperature ranges.
In addition, the thermoplastic-based materials have mechanical properties that provide a number of advantages to base station component OEMs, such as dimensional stability and low friction (important because the phase shifters are in constant motion), flame resistance and stable Dk within climate conditions ranging from –40°c to +55°c with 55% humidity. These thermoplastic materials are capable of complex geometries and miniaturization, unlike ceramics or PCBs and can also provide higher production yield rates than ceramics, contributing to potentially lower system costs.
The new THERMOCOMP Compound portfolio includes a range of products with Dk performance up to 13.9 at 3 GHz and Df performance up to 0.010 at 1.1 GHz. SABIC has achieved these results by its superior compounding ability – that is, leveraging a deep understanding of the molecular structure of the base resins and the filler materials to yield the desired performance results. SABIC’s dielectric portfolio consists of compounds using a variety of base resins, including LEXAN™ resin, a polycarbonate material; NORYL™ resin, a polyphenylene oxide resin; or high density polyethylene (HDPE) resin, which expands the ability for component manufacturers or system integrators.
