Molex will be showcasing its deep expertise and wide range of aerospace and defense industry solutions that meet high-performance needs at the Military Communications Conference (MILCOM), to be held October 26-28 at the Tampa Convention Center in Florida. By integrating speed, compact design and military-grade construction, as well as forming strategic partnerships and making acquisitions, Molex has developed an extensive portfolio of products that withstand harsh A&D applications.
Military applications are some of the toughest faced by electronic products and it is vital that the installation and replacement of sensors, encoders, switches and other I/O devices are accomplished easily and reliably. Molex understands the necessity to offer a range of technical, manufacturing and electrical solutions in the industry. They can meet most connector needs with an off-the-shelf or custom product quickly and cost-effectively.
Recently, Molex expanded its capabilities in the A&D market through its acquisition of certain assets of Minnesota-based Soligie, Inc., a provider of printed electronics solutions that incorporate multiple components—including LEDs, memory, sensors displays and batteries—onto thin, flexible substrates. Reducing weight, space, visual signature and costs is vital to A&D system assembly and finishing. A&D product applications include physiological monitoring of soldier performance, shock sensors for munitions, and more.
MOLEX will feature these and other solutions ideal for A&D:
Molex SMPM RF Blind-Mate Connectors. Designed for aerospace and defense, high-density computing and telecom applications, Molex SMPM RF Blind-Mate Connectors feature a compact 3.56mm pitch and deliver a frequency range of DC to 65 GHz. SMPM RF Connectors are 30 percent smaller than standard SMP connectors, reducing system weight while delivering excellent frequency performance and design flexibility in board-to-board blind-mate applications.
Multi-Port RF (MPRF) Coaxial Cable-to-Board Solutions. These secure MPRF connectors, with a rugged single housing design, are ideal for high-vibration conditions. Dual latches support the weight of coaxial cables, and the compact connectors also meet shrinking A&D electronic device space demands.
Hermetic-Sealed Multi-Fiber Circular MT Optical Assemblies. Delivering extreme sealing performance in a small footprint, Hermetic-Sealed Multi-Fiber Circular MT Optical Assemblies provide system reliability in extreme environments. Hermetic sealing for fiber optic connections has historically been limited to large, single-channel applications, but is now available in this high-density, reduced-footprint, multi-channel option.
FlexPlane™ Optical Circuitry. As one of the most versatile fiber routing systems on the market, Molex FlexPlane optical flex circuitry provides high-density routing on PCBs or backplanes and is compatible with multimode and single-mode MT/MPO and discrete fiber terminations, including MIL-PRF-29504s.
VITA 66.1 Ruggedized Optical MT Backplane Interconnect System. Designed for high-density A&D applications, the compact VITA 66.1 ruggedized optical MT backplane interconnect system meets the ANSI-ratified specification for blind mate fiber optic interconnects in VPX architectures, or can be used as a stand-alone solution outside of the VPX architecture.
Optical Industrial Assemblies and Adapters (Receptacles). Rated for NEMA 6P and IP67 dust and water protection, Molex Optical Industrial Assemblies mate to all small form-factor pluggable active devices by way of a 3-axis internal LC connector float. They are offered with a ruggedized metal or plastic housing for outdoor or indoor applications. They utilize an industry-standard (ODVA-compliant) plug and receptacle connector to ensure performance and compatibility with other compliant connector systems, these products are ideal for harsh-environment A&D applications.
Rigid Flex Circuits and Assemblies. Ultra-reliable Molex rigid flex circuits and assemblies minimize impedance discontinuities in high-speed military and aerospace data and telecommunications devices that are lightweight, portable and intended for use in harsh environments.
ResilientFlex™ Coiled Assembly. Supports high-speed signal transmission applications (such as SATA, SAS, etc.,) requiring flexible, expandable packaging for high-signal frequencies demanding tight impedance control and 12.0 Gbps data rates and beyond.
High-Speed Low-Loss Flex Circuit Assemblies, made using DuPont™ Pyralux® TK flexible circuit material. The assemblies are ideal for electronic data transmission applications such as servers and high-end computing, storage servers and signal processing.
Stop by Booth 433 at MILCOM 2015 to see MOLEX.
