Rohde & Schwarz has introduced test solutions for the Broadcom Max Wi-Fi chipset portfolio, the first complete ecosystem of 802.11ax Wi-Fi devices. The R&S CMW test platform can now be used by OEMs and ODMs to test Max Wi-Fi chipsets.
Next generation Wi-Fi, based on the IEEE 802.11ax standard, offers speed, capacity, coverage and battery-life improvements in congested environments. It uses technologies such as uplink/downlink orthogonal frequency division multiplexing access (UL/DL OFDMA), multi-user multiple input multiple output (MU-MIMO) and target wake time (TWT). These technologies pose challenges for test and measurement equipment. The T&M instruments from Rohde & Schwarz have been qualified for characterizing Broadcom Max Wi-Fi chipsets, both at the RF level for tests such as error vector magnitude (EVM), timing measurements and spectrum emission compliance, and at the protocol level for testing features such as multi-user scheduling, application services and network management. Through the Broadcom manufacturing test license program, Rohde & Schwarz is able to develop software for Max Wi-Fi chipsets and provide full 802.11ax test solutions to OEMs and ODMs.
The R&S FSW signal and spectrum analyzer and R&S SMW200A vector signal generator allow EVM tests well below -50 dB, providing the best performance for R&D testing. The R&S CMW270 wireless connectivity tester is another instrument licensed for Max Wi-Fi testing based on its real WLAN network emulation for IEEE 802.11a/b/g/n/ac/ax. The tester can verify and debug devices from the physical to the application layer within the OSI model.
Rohde & Schwarz will showcase a production-ready solution featuring the R&S CMW100 and the Broadcom Max Wi-Fi device at this year’s Mobile World Congress, from February 26 to March 1, 2018. For more information about Rohde & Schwarz at Mobile World Congress 2018, click here.
