At Embedded World 2019, Digi International will showcase its ConnectCore 8X system-on-modules (SOMs) and single board computers (SBCs), and the Digi XBee3 series of modules and modems. They will also host demonstrations and educational sessions that will illustrate the latest in embedded technology and its capabilities.
At the event, Digi will introduce ConnectCore 8X development kits, which are designed to provide hardware and software engineers, corporate technologists, and even educators and students with the opportunity to gain hands-on experience in integrating connectivity into their IoT solutions and applications.
Digi's extremely small, Digi SMTplus form factor ConnectCore 8X SOM and SBC utilize the NXP i.MX 8X family based on ARM Cortex-A35 and Cortex-M4F cores. Designed for ultimate reliability and design freedom, the ConnectCore 8X offers 2X2 MIMO 802.11ac + Bluetooth Smart connectivity, graphics, video, image processing, audio/voice capabilities, as well as Digi TrustFence security for advanced IoT applications for highly regulated sectors including medical/healthcare, transportation, building automation, advanced HMI, and industrial.
The Digi XBee3 series of smart edge RF modules and cellular modems are highly integrated, compact and designed to support IoT innovation at the network edge. With a modular approach to IoT connectivity, the Digi XBee3 series enables the integration of new functions with MicroPython programmability, dual-mode radios and the ability to upgrade firmware over-the-air (OTA). These functionalities enable wireless design flexibility, cost-effective integration and easily added custom business logic at the network edge. The result is innovative IoT solutions that can be more quickly developed, prototyped and mass-produced.
Planned Product Introductions and Demonstrations:
- ConnectCore 8X: The Digi ConnectCore 8X SOMs and SBCs demo in the Digi booth with NXP (Digi is an NXP early access partner) and Au-Zone will highlight advanced machine learning and image recognition capabilities and design flexibility.
- Remote IoT Connectivity with Digi XBee3 Cellular: Digi will showcase its remote device management capabilities between a Digi XBee3 Cellular device and the cloud-based Digi Remote Manager by remotely monitoring and controlling devices directly from the trade show floor.
- Digi XBee3 End-to-End IoT Networking: Digi will present the latest advancements in the Digi XBee3 platform, including multi-protocol support (Zigbee, CAT-1, LTE-M, NB-IoT + Bluetooth LE), with an IoT networking solution composed of Digi XBee3 modules, Digi XBee Industrial Gateways, and network/device management tools. These updates enable new use cases for improved installation, local control diagnostics, and configuration. The network and device management element will use a new XCTU® Mobile application for the Digi XBee configuration over Bluetooth via a phone or tablet.
- SteadyServ iKeg: This application demonstration will show the SteadyServ iKeg using sensors to measure keg volume, analyze the data locally with a Digi XBee Industrial Gateway, then send the analysis into the cloud over a Zigbee connection. The iKeg application presents the cloud-based information to bar managers to help accurately inventory and proactively order more when beer runs low.
Educational session
- On Wednesday, February 27, from 11:30 a.m. – 12:00 p.m., Andreas Burghart, solutions sales engineer at Digi International, and Richard Elberger, global IoT partner solutions architect at AWS, will co-host a session as part of Session 1.1 in the Internet of Things track titled, "Where the Cloud Meets the Edge: Five Tenets for Success at the Edge." The session will look at cloud and edge computing capabilities and finding the right hardware to deliver intelligence where it matters most.
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