The IEEE Compound Semiconductor IC Symposium (CSICS) Exhibition will bring together experts in compound semiconductor ICs as well as high speed silicon and other advanced technology ICs. The CSICS will include presentations from worldwide submissions on all aspects of the technology, from materials and device fabrication and modeling to IC design and testing, high-volume manufacturing, and system applications. It will also feature the very latest results in RF/microwave, millimeter-wave, THz, analog mixed signal, and optoelectronic integrated circuits.
Submission Deadlines
Paper Submission Deadline: 2 May 2014
Author Notification: 13 June 2014
Camera Ready Papers Due: 25 July 2014