Dyconex, an MST company, has announced an advanced rigid multilayer substrate material that can be used to develop ultra-thin build-ups for various high-frequency applications like HF chip packaging.
The material has good dielectric properties (low Dk and low Df) combined with a low thermal expansion coefficient (CTE) and high dielectric strength. Using anylayer technology the layers of the substrates are connected by laser drilled, copper filled microvias allowing for high-density / high-reliability designs. Other HDI build-up solutions are also available.
Key Features of the Substrate Include:
- Epoxy-based laminates with low dielectric properties
- High Tg, low CTE and high dielectric strength
- Ultra-thin any layer HDIs from 4 layers (~220 µm) to 8 layers (~350 µm) with highest reliability
- Impedance controlled ultra-fine line technology (down to 25 µm)
- High-density pitch design (~175 µm)
- Smallest via (50 µm) in pad (100 µm)
- EN 9100:2009 certification
Click here to learn more about design features and layer build-up characteristics of this substrate.
