StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announced that StratEdge technical experts will be available to discuss the best types of packaging and assembly services for devices at the virtual International Symposium for Microelectronics (IMAPS) 2020.
StratEdge will showcase its newly introduced line of hermetic, Ka-band, QFN packages for 5G and satellite applications at IMAPS. The thermally enhanced broadband packages have been designed for DC to 43 GHz. StratEdge offers post-fired ceramic, low-cost molded ceramic, and ceramic QFN packages, and specializes in packages for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices.
Casey Krawiec, VP of global sales for StratEdge Corporation, stated that much attention is given to GaN chips, but the package in which the GaN is attached and the way the chip is attached to the package is often overlooked. They have developed a proprietary eutectic die attach method that produces extremely thin, low-void bond lines between the device and package heat sink. StratEdge also provides the same service for die-on-tab.
StratEdge will also show their new ISO 9001:2015 facility with a Class 1000 cleanroom, including Class 100 work areas with ESD control for performing sensitive operations.
Click here to read the new white paper - Eutectic Die Attach Optimizes High Power GaN Devices.
Click here to learn more about StratEdge and their packaging solutions.
