RFaxis announced that it will be offering its entire product line of pure-CMOS, single-chip / single-die RF Front-end ICs (RFeICs) in bare die form, enabling its customers to further reduce the size and bill of materials (BOM) cost of wireless products for both the Wi-Fi and Internet of Things (IoT) markets. RFaxis has been in mass production of its RFeICs mostly in industry-standard Quad Flat No-Lead (QFN) packages that range from 3x3mm to 1.6x1.6mm in size. These RFeICs serve a wide spectrum of the fast-growing wireless technologies including IEEE 802.11b/g/a/n/ac WLAN, 802.15.4 / ZigBee, Bluetooth / Bluetooth Low Energy, wireless audio / video, home automation, smart energy, and many emerging applications for the IoT.
RFaxis is the only company that is shipping pure-CMOS RF front-end solutions with uncompromised performance at utterly disruptive pricing. With the pure-CMOS bare die solution, RFaxis offers a much sought-after solution in terms of size, performance and cost. The ODM/OEM customers while gaining access to bare die, will be able to offer more compact solutions at much lower costs to their end customers.
The target markets for RFeICs continue to grow explosively, with Wi-Fi shipments projected to exceed three billion units annually by 2017, and the IoT market to reach at least 50 billion units annually by 2020. Some industry experts forecast that the unit cost of IoT sensor nodes will be nearing the $1 range in order to make them ubiquitous, leaving little room for costly semiconductor components such as GaAs or SiGe.
