Freescale Semiconductor has introduced two high RF power transistors housed in plastic packages. The MRFE6VP61K25N delivers power in excess of 1250 W CW, and the MRFE6VP6600N delivers power in excess of 600 W. Both transistors provide a 30 percent reduction in thermal resistance compared to ceramic-packaged transistors. This thermal resistance, combined with CW power, high efficiency and gain, can help lower system costs through enhanced performance and reduced cooling materials.
The new products are ideal for use in industrial and broadcast applications including CO2 lasers, plasma generation equipment, MRI amplifiers and particle accelerators, as well as FM and VHF broadcast transmitters. Compared to traditional ceramic RF packages, Freescale’s plastic packaging offers superior thermal resistance as well as tighter dimensional tolerances and compatibility with mass volume soldering processes.
In addition to the exceptional performance of these new devices, Freescale also has a range of extremely rugged transistors designed for harsh industrial environments from 1 to 600 MHz. Their portfolio now comprises of five parts in ceramic and five parts in plastic that address power requirements from 25 W to 1250 W.
The MRFE6VP61K25N is now in production, and the MRFE6VP6600N is sampling, with production expected in April. For more product information please contact Freescale sales and approved distributors. Click Here to for support tools, including reference circuits and simulation models.
