Isola Group has introduced the IS350MD to its portfolio of halogen-free laminates and prepregs for high-end mobile applications. The IS350MD fits nicely between Isola’s well-established standard dielectric constant (Dk) material, DE156, and the company’s ultralow Dk material, IS300MD, which was introduced in 2014 and quickly gained momentum in the High Density Interconnect (HDI) market.
The demand for faster processing and more efficient designs in smartphones and tablets is driving the need for thinner, more powerful PCBs. These thin PCBs require low-Dk laminate materials to meet the impedance requirements of these advanced designs. IS350MD with a Dk of 3.51 was engineered specifically for these types of ultrathin dielectric applications.
IS350MD is an FR-4 type base material with a resin matrix; it is based on a modified epoxy resin reinforced with conventional E-glass fabric. The requirements of flammability class V-0 per UL-94 are met without the addition of antimony compounds. As this laminate material does not contain halogens, it displays greater thermal stability than a standard FR-4, as demonstrated in its Time to Delamination (T288) measurements.
The IS350MD is engineered for ease of manufacturing. Its laminate and prepreg can be tailored to any thickness to meet the needs of the latest multilayer HDI buildup technologies. It requires a short press cycle and, similar to FR-4 materials, it does not require plasma for desmearing, making it ideal for HDI mobile applications, while providing a very competitive low cost of total ownership.
