Cirexx International has announced that they will be presenting their ECLIPS technology at IMS 2015 in Phoenix in May. ECLIPS (Embedded Cooling Layer – Integrated Power System) is a way of producing high-power RF/microwave Printed Circuit Boards (PCBs) employing an embedded low-CTE, thermally engineered metalized heat-sink layer with superior thermal conductivity characteristics.
This technology is an alternative to co-fired ceramics and hybrid integrated circuits. It is essentially a common Printed Circuit Board, made from otherwise typical Printed Circuit Board materials and processes. But with the high thermal conductivity and very low CTE (Coefficient of Thermal Expansion) the user can direct attach bare die such as GaN and GaAs. The other electronic components on the board can be standard “plastic parts” attached in a standard process such as a vapor phase soldering. This results in an electronic board system that is smaller, lighter weight, and certainly much less costly than the ceramic hybrid, all-die alternative.
Al Wasserzug, Cirexx ECLIPS Product Manager, and Don Kaufman, Director of Sales & Marketing will be discussing this technology at their Booth at the IMS 2015. Stop by to learn more. They will have examples of ECLIPS PCBs and HPA modules as well technical Data Sheets for visitors.
