Wireless technology has become an essential component of many modern devices and systems, and Wi-Fi and Bluetooth modules are an important part of this trend. Wi-Fi and Bluetooth modules provide reliable wireless connectivity and are easy to integrate into existing systems to add wireless connectivity to a wide range of applications. These modules are used in a variety of applications, including the Internet of Things (IoT), home automation systems, and portable devices. Here at everything RF, we have compiled a comprehensive list of the trending Wi-Fi/Bluetooth Modules in 2022.
Note: This list has been compiled based on user activity on everything RF. To ensure that we cover the whole range of test equipment we limited the number of products from each category and company. The listed products are shown in random order and are grouped by category.
Dual-Band Wi-Fi 6, Bluetooth 5.0 & FM Combo Chip
The BCM43752 from Broadcom is a dual-band 802.11ax (Wi-Fi 6), Bluetooth 5.0, and FM Combo Chip. The chip integrates power amplifiers and low-noise amplifiers to enable low power and the best receiver sensitivity for mobile applications. This chipset provides a dual-stream spatial multiplexing data rate of up to 1200 Mbps. It supports 20/40/80 MHz channels with 1024-QAM modulation and Client MU-MIMO operation. Read more
Dual-Band Wi-Fi 6E/Bluetooth 5.0 Combo Chip
The BCM4389 from Broadcom is a Wi-Fi 6E and Bluetooth 5.0 Combo Chip designed for low-power mobile devices and AR/VR devices. Wi-Fi 6E extends the Wi-Fi 6 standard to support the soon-to-be-operational 6 GHz band with wider 160 MHz channel bandwidths that double Wi-Fi speeds and cut latency in half compared to Wi-Fi 5. The BCM4389 delivers over 2 Gbps of real-world speeds and has up to five times better battery utilization, making it an ideal solution for flagship smartphones and future AR/VR devices. Read more
2.4/5 GHz Wi-Fi 6 + BLE 5.2 + 802.15.4 Triple-Radio Chipset
The IW612 from NXP Semiconductors is a 2.4/5 GHz Dual-Band Wi-Fi 6 + BLE 5.2 + 802.15.4 Triple-Radio single-chip solution. It is optimized for a broad array of IoT and industrial applications in smart homes, smart devices and accessories, smart appliances, smart energy, industrial automation, gateways, and many more. This highly integrated chipset lowers system cost and has a minimum external BOM while achieving efficient coexistence between all internal radios as well as external radios, such as LTE. This radio has an integrated power amplifier (PA), low noise amplifier (LNA), and Tx/Rx switch and supports UL/DL MU-MIMO and OFDMA features. Read more
LoRa Edge™ Transceiver for Multi-Band Worldwide Asset Management
The LR1120 from Semtech is a Multi-Band LoRa Edge Transceiver that supports Long Range - Frequency Hopping Spread Spectrum (LR-FHSS) communication over 150-960 MHz (sub-GHz) and 2.4 GHz ISM bands as well as licensed S-Band for satellites. It complies with LoRa Alliance’s LoRaWAN specifications and has a multi-constellation GNSS scanner and a passive Wi-Fi Access Point address scanner. This transceiver has Tx power up to +22 dBm and an Rx sensitivity of up to -144 dBm. It has an integrated PA regulator supply selector for simplified dual-power with one-board implementation. Read more
Low-Cost Bluetooth Low Energy Module for IoT Applications
The SmartBond TINY DA14531 from Dialog Semiconductor is a Bluetooth Low Energy Module with an integrated antenna. Based on a Bluetooth 5.1 SoC, this module is optimized to significantly reduce the cost of adding BLE functionality to an IoT system. Its easy-to-use design and software allow developers to quickly and intuitively develop highly functional connected devices, targeting the next generation of the connected consumer, connected medical, smart home, and smart appliance applications. Read more
Wi-Fi 6, Bluetooth 5.2, and 802.15.4 Modules for IoT Applications
The MAYA-W2 Series from u-blox are Wi-Fi 6, Bluetooth 5.2, and 802.15.4 Modules that are designed for IoT applications. They provide SISO Wi-Fi 6 operation with data throughput of up to 600 Mbit/s (Wi-Fi 6) and support MU-MIMO to provide exceptional performance even in dense Wi-Fi environments. These modules are based on NXP IW611 or IW612 chips which provide OS driver integration in their application host BSPs and SDK support for NXP MCUs. They support Wi-Fi 802.11d/e/h/i/k/r/u/v/w/az, Bluetooth BR, EDR, LE Audio & LE long-range protocols, and 802.15.4 radio Thread & Zigbee mesh networks. Read more
Wi-Fi (2.4 and 5 GHz) + Bluetooth 5.0 Combo Module for Automotive Applications
The CYW89373 from Infineon Technologies is an Automotive Wi-Fi + Bluetooth Combo module that supports 802.11 a/b/g/n/ac Wi-Fi specifications and Bluetooth 5.0 (BR + BLE + EDR). It features Infineon Technologies' Real Simultaneous Dual Band (RSDB) solution that provides simultaneous Wi-Fi operation in both 2.4 GHz and 5 GHz bands with a single-MAC architecture supporting 1x1 SISO operation and provides a data rate of up to 433 Mbps. This connectivity solution has PCIe Gen1 (v3.0 compliant) or SDIO 3.0/2.0 Wi-Fi interface, I2S/PCM audio, HCI-over UART Bluetooth interfaces, and driver support for Android and Linux operating systems. Read more
Wi-Fi 6 + Bluetooth 5.2 Module for IoT Applications
The Type 1XL from Murata is a Wi-Fi 6 + Bluetooth 5.2 Module that operates at 2.4 and 5 GHz. It delivers a data rate of up to 1200 Mbps with Wi-Fi and up to 2 Mbps for Bluetooth. This module is based on the NXP 88W9098 combo chipset and supports Wi-Fi 802.11a/b/g/n/ac/ax 2×2 MU-MIMO and Bluetooth BR/EDR/LE specifications. It has implicit and explicit beamforming to support dual 2x2 Wi-Fi operation and supports modulation schemes up to 1024 QAM. The module employs highly sophisticated and enhanced hardware mechanisms and algorithms to optimize Wi-Fi and Bluetooth coexistence for maximum performance. It requires a DC supply of 1.8/3.3 V and consumes 1873 mA of current. Read more
Bluetooth 5./Zigbee 3.0 Module for Lighting, Home Automation, Beacons, and Industrial Applications
The STM32WB5MMG from STMicroelectronics is a Bluetooth 5.3/Zigbee 3.0 Module that supports OpenThread, dynamic/static concurrent modes, and 802.15.4 proprietary protocols. It is based on ST’s STM32WB55VGY wireless microcontroller which provides good receiver sensitivity and a high-output power signal. The module supports a data rate of 2 Mbit/s and has a range of up to 75 meters. It provides a Tx power of 6 dBm and has a receiver sensitivity of -96 dBm (Bluetooth), and -100 dBm (802.15.4). Read more
2.4/5 GHz Wi-Fi (802.11 a/b/g/n) + Bluetooth LE 5.0 Module
The WE310G4 from Telit is a Dual-Band Wi-Fi (802.11 a/b/g/n) and Bluetooth Low Energy (BLE) 5.0 Coexistence Module that operates in the 2.4/5 GHz bands. It provides a low-cost, high-speed serial-to-Wi-Fi/BLE connection to an embedded design built on an 8/16/32-bit microcontroller through UART, SPI, or SDIO interfaces. The module is ideal for users with limited Wi-Fi/BLE or RF expertise or those seeking a faster time to market. It is IEEE 802.11 a/b/g/n and Bluetooth certified and complies with Wi-Fi Alliance and BT SIG-v5 requirements. The module is designed for use in smart homes, healthcare, medical, industrial, and commercial applications. Read more
802.11ac/abgn PCIe WLAN with Bluetooth 4.2 Single-Chip Controller
The RTL8821CE from Realtek is a Wireless SoC that supports 1-stream 802.11ac solutions with Multi-user MIMO (Multiple-Input, Multiple-Output) and Wireless LAN (WLAN) PCI Express network interface controller with integrated Bluetooth 2.1/3.0/4.2 USB interface controller. It combines a WLAN MAC, a 1T1R capable WLAN baseband, and RF in a single chip. The RTL8821CE-CG provides a complete solution for a high-performance integrated wireless and Bluetooth device. Read more
Wi-Fi 6-ready Chipset with Bluetooth 5, WPA3 Security, and Digital FM
The WCN3998 from Qualcomm is a 2x2 Wi-Fi 6-ready integrated chipset with Bluetooth 5, WPA3 Security, and digital FM. Ideal for smartphones and computing devices, this mobile connectivity chipset supports WPA3 encryption, the latest and most secure protocol announced by the Wi-Fi Alliance that provides robust protection of user passwords and stronger privacy in Wi-Fi networks. It has advanced 8x8 sounding, providing up to 2x increase in network capacity when compared to other devices only supporting 4x4 sounding. Read more
2.9 Gbps MU-MIMO Wi-Fi 6 (2.4, 5, 6 GHz) and Bluetooth 5.2 SoC
The WCN6750 from Qualcomm is a 2x2 MU-MIMO Wi-Fi 6/6E (2.4, 5 & 6 GHz) and Bluetooth 5.2 SoC. For Wi-Fi 6/6E it has a 160 MHz channel in both the 5GHz and 6GHz bands and delivers a data rate of up to 2.9 Gbps. This SoC supports Qualcomm’s TrueWireless, TrueWireless Stereo Plus, aptX Adaptive and aptX Voice audio technologies for Bluetooth LE Audio scenarios. It has dual Bluetooth antennas and supports 1-to-many Bluetooth broadcast. The SoC can be controlled via PCIe and UART interfaces. It supports Qualcomm's 4K QAM technology and is ideal for smartphones, computers, wireless headphones, earbuds and speakers, mobile gaming, and XR applications. Read more
Wi-Fi HaLow (IEEE 802.11ah) SoC for IoT Applications
The MM6108 from Morse Micro is a Wi-Fi HaLow (IEEE 802.11ah) SoC for IoT Applications. This SoC augments Wi-Fi by operating in a spectrum below 1 GHz to offer a longer range and lower power connectivity. Wi-Fi HaLow meets the unique requirements for the Internet of Things (IoT) to enable a variety of use cases in industrial, agricultural, smart building, and smart city environments.
This SoC supports 1, 2, 4, and 8 MHz channel bandwidths and delivers a data rate of up to 43.3 Mbps. It can be controlled via SDIO 2.0, SPI, GPIO, UART, I2C, and PWM interfaces. Read more
2.4/5 GHz Wi-Fi 6 Companion IC for IoT Applications
The nRF7002 from Nordic Semiconductor is a 2.4/5 GHz Wi-Fi 6 Companion IC for low-power and secure IoT applications. It is designed to provide seamless Wi-Fi connectivity and Wi-Fi-based location (SSID sniffing of local Wi-Fi hubs) alongside Nordic’s existing products. This IC has 1 spatial stream (SS) and a channel bandwidth of 20 MHz. It supports up to 86 Mbps of PHY throughput using the 64 QAM (MCS7) modulation technique. This IC supports OFDMA technology in both downlink and uplink along with BSS colouring feature. Read more
Dual-Band Wi-Fi 6 + Bluetooth 5.1 Wireless SoC
The 88W9098 from NXP Semiconductors is a 2.4/5 GHz wireless SoC that is based on the latest IEEE 802.11ax standard and implements an innovative concurrent dual Wi-Fi and dual-mode Bluetooth 5.1 architecture. The SoC provides gigabit-level Wi-Fi performance, superior reliability, and enhanced security to enable high-performance, flexible solutions for the IoT, Access, and Industrial markets. It has 20/40/80 MHz channel bandwidths and supports implicit and explicit beamforming. The module supports 1024 QAM and downlink/uplink OFDMA and MU-MIMO. Read more
Low-Power Bluetooth LE/802.15.4 SoC for Matter Networks
The CYW30739 from Infineon Technologies is a Bluetooth LE and IEEE-802.15.4 SoC that is designed for low-power multi-protocol smart home systems. It can enable end-to-end encrypted communication between individual devices in a Matter network, which is an IP-based network connectivity standard for secure and seamless connectivity between devices. The SoC is based on a 96 MHz ARM Cortex-M4 microcontroller unit featuring a low-power radio for long-range Bluetooth and multi-protocol connectivity. The microcontroller has a floating-point unit that delivers high-performance computing as well as has a highly optimized memory system across flash, RAM, and ROM. Read more
Wi-Fi 6 Front-End Module from 5150 to 5850 MHz
The QPF4532 from Qorvo is a Wi-Fi 6 (802.11ax) Front-End Module that operates from 5150 to 5850 MHz. It has an integrated 5 GHz power amplifier (PA), single pole two throw switch (SP2T), and bypassable low noise amplifier (LNA). The FEM delivers an output power of up to +25 dBm with a Tx gain of 31 dB and provides an Rx gain of 13.5 dB with a noise figure of 2 dB. The performance of this module is focused on optimizing the PA for a 3.3 V supply voltage that conserves power consumption while maintaining the highest linear output power and leading-edge throughput. Read more
WiFi 6E Front End Module for High-Power Applications
The SKY85784-11 from Skyworks is a Wi-Fi 6E High-Power Front End Module (FEM) for Wi-Fi 6E applications. It consists of a SPDT Tx/Rx switch, a high gain Low Noise Amplifier (LNA) with bypass and a Power Amplifier (PA). In the Tx path, the high performance PA provides an output power of 19 dBm with a gain of 33 dB. In the Rx path, the LNA delivers a gain of 16 dB and has a low DEVM of -43 dB. The FEM is available in a small, 24-pin package that measures 3 x 5 mm and is suitable for WLAN-enabled wireless video streaming systems, indoor & outdoor networking systems. Read more
2.4 GHz WLAN Front-End IC for Wi-Fi 6 Applications
The WLAN7207H from NXP is a 2.4 GHz WLAN Front-End IC that is designed for Wi-Fi 6 applications. It includes a Tx power amplifier with a directional coupler, a low-noise receive amplifier, and a transmit/receive switch with a Bluetooth channel. The power amplifier supports 3 different TX gain modes to improve power efficiency. This front-end IC is fully matched to 50-ohms and integrates harmonic and out-of-band filtering which minimizes the external component count. Read more
802.11ax (Wi-Fi 6) Front-End Module from 5 to 7 GHz
The PE565211 from PSemi is an 802.11ax Wi-Fi 6 Front-End Module that operates from 5150 to 7150 MHz. It is a high-performance module that enables full and efficient integration by combining intelligent capabilities of pSemi’s patented UltraCMOS technology, an advanced form of Silicon-on-Insulator (SOI) technology that offers the performance of GaAs with the economy and integration of conventional CMOS. This module is equipped with a fully-matched bypassable amplifier (LNA), a dual-core power amplifier (PA), two RF switches that include SP3T and SP4T, and a bypass path with RxAux port. Read more
Click here to visit the Bluetooth Hub on everything RF.
Click here to visit the Wi-Fi Hub on everything RF.
