Transline Technology, a leading provider of advanced printed circuit board (PCB) solutions, will be at the International Microwave Symposium (IMS) 2024, in Washington D.C. next week. The company is renowned for its pioneering work in RF/MW and mmWave PCB technology which they will showcase and talk about at their booth.
Transline Technology will leverage its participation in IMS 2024, and this international platform to showcase its unique proficiency in manufacturing metal-backed PCBs. These PCBs offer superior thermal performance and reliability, catering to the evolving demands of high-frequency applications in industries such as telecommunications, aerospace, defense, and beyond.
“We are thrilled to be exhibiting at IMS 2024 again this year, and look forward to sharing our latest advancements in RF/MW and mmWave CB manufacturing,” said Chris Savalia, CEO at Transline Technology. “Our strong focus on high-frequency applications allows us to deliver solutions that empower our clients to push the boundaries of technology.”
Attendees visiting Booth #733 will have the opportunity to engage with Transline’s team of experts, who will provide insights into the company’s capabilities and discuss how their metal-backed PCBs can address specific project requirements.
IMS 2024 serves as a premier gathering for professionals and organizations at the forefront of microwave and RF technologies. With an extensive exhibition, technical sessions, and networking opportunities, the event facilitates collaboration and knowledge exchange among industry leaders and innovators.
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