Qorvo has announced a series of innovations intended to accelerate the deployment of high-speed cable TV (CATV) DOCSIS 3.1 networks while providing cable designers greater flexibility in product design. Qorvo's newest multi-chip module packaging, thermal sensing pins, and advanced gallium nitride on silicon carbide (GaN on SiC) integration capabilities enable CATV product designers to lower costs, increase bandwidth, and reduce board space.
Qorvo's multi-chip-module (MCM) packaging helps customers reduce board space by up to 50 percent and enables up to 30 percent cost savings versus traditional SOT115J packaging. This MCM packaging includes temperature-sensing pins, which ensure proper assembly and provide optimal thermal management. To facilitate the use of its newest advanced MCM capabilities, Qorvo offers customers PCB layout and thermal design support services.
Multi-system operators (MSOs) can leverage the market leading output and gain performance of GaN on SiC technology to upgrade equipment within existing product footprints, saving installation time and cost while enhancing performance. Additionally, GaN on SiC technology helps reduce overall power consumption by up to 20 percent with associated features such as adjustable current control.
Qorvo is leveraging their broad portfolio of advanced packaging and process technologies to help CATV customers lower costs, increase bandwidth, and achieve significant board space savings. They shipped more than two million CATV GaN amplifiers and is the industry-leading GaN supplier for the cable market. Their newest DOCSIS 3.1 products include the RFCM3316 and RFCM3326 GaN-based power doubler amplifiers and are available in miniaturized 9mm x 8mm MCM packaging.
everything RF has listed Qorvo's complete range of DOCSIS 3.1 Products:
Qorvo DOCSIS 3.1 Amplifiers
Qorvo DOCSIS 2.1 Switches (Adding Data)
