MACOM Technology Solutions (“MACOM”), has announced a long-term investment plan to modernize its Massachusetts and North Carolina semiconductor wafer fabrication facilities. MACOM’s five-year strategic investment plan of up to $345 million is supported by a recently executed preliminary, non-binding agreement with the CHIPS Program Office, which would provide for proposed direct funding from the U.S. Department of Commerce under the CHIPS and Science Act of up to $70 million.
The preliminary terms propose up to $180 million to be supported by the CHIPS and Science Act through a combination of direct Federal funding, Federal Investment Tax Credits and State funding, including direct funding from the Massachusetts Technology Collaborative of up to $15.7 million as well as other incentives from the State of Massachusetts. It is expected that the balance of approximately $165 million would be self-funded by MACOM’s operating cash flow over the next five years.
This wafer fab capital investment plan supports MACOM’s growth and market positioning strategy to be an industry leading supplier of advanced RF, microwave and millimeter wave semiconductor technologies. MACOM’s innovative technology and product portfolio supports existing and emerging defense, telecommunications and data center applications.
Massachusetts Wafer Fabrication Facility Investment Highlights
- Expansion of clean rooms within existing building footprint
- Modernization of current 100mm production lines, including GaAs, GaN, Silicon and other III-V materials
- Installation of 150mm GaN-on-SiC manufacturing capability for advanced node applications
- Infrastructure upgrades (HVAC, water, solar and power systems)
North Carolina Wafer Fabrication Facility Investment Highlights
- Expansion of clean rooms within existing building footprint
- Installation of 150mm wafer size production capabilities to support RF GaN-on-SiC processes
- Installation of advanced MOCVD epitaxial growth capabilities
- Infrastructure upgrades (HVAC, water, power systems)
“This plan will strengthen MACOM’s domestic semiconductor manufacturing capabilities, accelerate our growth strategy and enable us to better service our customers with leading technologies,” said Stephen G. Daly, President and Chief Executive Officer, MACOM.
MACOM expects to work with the CHIPS Program Office to finalize the details and terms of a definitive agreement.
Click here to learn more about MACOM.
