Qorvo has unveiled three new DOCSIS 3.1-ready power doubler multi-chip modules (MCMs). Their newest power doubler MCM amplifiers provide cable broadband service providers an easy upgrade path to DOCSIS 3.1 with maximum design flexibility. The compact MCM packaging provides a cost effective solution, saving up to 70% board space compared to traditional hybrid packages.
These MCMs feature temperature-sensing pins to ease assembly, reduce power consumption and provide added confidence during printed circuit board reflow. A combination of DC power adjust and current adjust capability allows operators to manage networks intelligently and reduce power consumption without sacrificing performance.
The RFCM3327 and RFCM3328 feature their GaN on SiC process to deliver superior thermal conductivity. The RFCM3327 offers 23 dB gain, while the RFCM3328 offers 25 dB gain. Both power doublers are capable of +63 dBmV power output, the highest performance in their class, and both include an external current control feature that allows customers to reduce overall power consumption by up to 20% while meeting required linearity specifications.
The QPB8808 is notable for its compact footprint, which saves up to 70% printed circuit board space over competing solutions. The 12V amplifier operates from 45 MHz to 1218 MHz, offers 20.5 dB gain and +58 dBmv power output, and includes a variable current bias adjust feature to conserve power while maintaining high output.
Qorvo offers more than 60 DOCSIS 3.1 ready components, including attenuators, switches, power doubler amplifiers, pre-driver gain blocks, push-pull amplifiers and reverse path amplifiers. They use highly differentiated, internally developed process technologies, including GaN high-electron-mobility transistor (HEMT), to deliver superior linearity, output power and reliability.
Qorvo is featuring its DOCSIS 3.1 portfolio at the ANGA COM 2016 European Exposition and Congress, in Cologne, Germany from June 7-9, 2016.