As the 200 mm wafer test market continues to expand, MPI Corporation has introduced a new fully automatic wafer probe system. The TS2500-RF addresses multiple production test market requirements which include RF communication devices and discrete passive components. This system is based on the industry leading and highly reliable automatic LED probe systems from MPI’s Photonic Automation Division with 1000’s of installations worldwide.
With the TS2500-RF, they are addressing the widely expanding production test market of RF communication devices and discrete RF passive components. MPI plans to continue focusing uon innovations and synergies between all their divisions to provide maximum value for served markets and to reinforce their mission to reduce the overall cost of test.
Available for both ambient and/or hot temperature operation modes, this TS2500-RF can reach maximum speeds of 10 Dies/second (depends on configuration) which makes it an ideal choice for production electrical tests on discrete RF devices. The unique design of MPI wafer chucks and wafer lift pins can safely handle wafers with thickness down to 50 micrometers and thus enable testing of challenging thin III-Vs compound wafers. Advanced alignment features such as off-axis and chuck mounted upper-looking cameras make it an ideal platform for testing within complex RF measurement configurations.
The TS2500-RF can be configured with their advanced RF accessories such as, RF MicroPositioners, RF cables, calibration substrates and TITAN RF probes to ensure precise and accurate RF measurements. With integration of the Vector Network Analyzers (VNA) closer to the DUT, the MPI partnership with Rohde & Schwarz, and new advanced calibration techniques, this fully-automatic probe system becomes a complete measurement solution that addresses the complexities of RF production test.
