Rogers Corporation will bring their materials expertise to PCB West on September 14 at the Santa Clara Convention Center (Santa Clara, CA). They will exhibit their high-performance circuit materials in addition to supporting a technical symposium for printed-circuit-board (PCB) users and designers with a presentation on the effects of conductor metal surface roughness on high-frequency PCB performance.
They will show a sampling of their material-based solutions, including RO3003 laminates which are ideal for loss-critical millimeter wave frequency designs, where consistent circuit performance matters, such as automotive radar sensors and point-to-point microwave backhaul communications systems. While already a benchmark for 77 GHz automotive radar sensors, RO3003 3.0 dielectric constant laminates are available with ½ ounce and 1 ounce rolled copper foil. Combining the very low dielectric loss of the RO3003 PTFE-ceramic resin system with smooth foil, results in high frequency circuit materials with best-in-class insertion loss. Also available with up to 0.040” thick copper plate.
The 92ML thermal management materials will also be showcased. These are designed to dissipate heat in high-power applications, thermally enhanced 92ML laminates and prepregs are halogen-free, flame-retardant thermally conductive epoxy-based thermoset materials with outstanding heat-transfer characteristics. They provide a cost-effective, lead-free-solder-compatible solution for effectively dissipating heat in multilayer circuit designs.
With a glass transition temperature (Tg) of +160C and high thermal conductivity of 2.0 W/m•K, 92ML materials can be supplied with copper cladding to 4 oz. thickness, to handle the most demanding heat-transfer requirements in power supplies and automotive electronics. When even greater cooling capability is needed, 92ML StaCool™ laminates are available with an insulated metal substrate (IMS). The IMS heatsink can be machined to a customer’s requirements, serving as part of the mechanical design in the final application.
Their thermal management materials also includes COOLSPAN® TECA adhesive film for bonding heatsinks to circuit materials with reliable thermal interfaces. This lead-free-process-compatible thermoset, epoxy-based, silver-filled adhesive film features outstanding thermal conductivity of 6 W/m•K to ensure thermally stable bonds between heatsinks and PCB materials. COOLSPAN TECA represents a practical alternative to fusion bonding, sweat soldering, press-fit, and other methods for attaching circuits to heatsinks and other mechanical structures.
Rogers CLTE-XT™ laminates also combine ceramic and PTFE materials to achieve excellent electrical and mechanical stability for a wide range of applications, from amplifiers to passive components. These materials are characterized by low coefficient of thermal expansion (CTE) in all three axes and stable Dk with temperature. They are well suited for phase-sensitive circuits including in microwave feed networks and in satellite-communications (satcom) systems.
Quick Turn Inventory Program
Visitors to Booth 201 can also learn about Rogers’ Quick Turn Inventory Program for North American fabricators. The program assists those faced with time-sensitive prototyping requirements by shipping select RO4000® circuit materials within two business days after receipt of order. Products included are: RO4003C, RO4350B, and RO4835™ laminates and RO4450B™ and RO4450F™ bondply materials.
