Nordic Semiconductor has announced that Japan-based electronic component and wireless module manufacturer, Taiyo Yuden, has selected their nRF52832 Bluetooth low energy System-on-Chip (SoC) for its EYSHSNZWZ Bluetooth low energy module. The EYSHSNZWZ is a Bluetooth 5 ready ultra low power module designed for a range of space-constrained applications including mHealth devices, wearables, and smartphone accessories.
The EYSHSNZWZ employs 3 x 3.2 mm wafer level-chip scale package (WL-CSP) variant of Nordic’s nRF52832 SoC, and includes an embedded high performance printed PCB antenna, resulting in an ultra compact 3.25 by 8.55 by 0.9mm form factor, in order to aid non-expert RF developers of complex wirelessly-connected Bluetooth 5-enabled products. With a maximum output power of +4 dBm and an operating temperature range of -40 to 85⁰ C, it offers 14 general-purpose input/outputs (GPIOs), SPI, UART, I2C, I2S, PDM and 12bit ADC interfaces, and is also pre-certified to FCC, ISED, and MIC standards.
Nordic’s nRF52832 Bluetooth low energy SoC, a member of Nordic’s sixth generation of ultra low power (ULP) wireless connectivity solutions enables the module to power even the most complex, processor-intensive wireless applications. The SoC combines a 64 MHz, 32-bit ARM Cortex M4F processor with a 2.4 GHz multiprotocol radio (supporting Bluetooth 5, ANT and proprietary 2.4 GHz RF software) featuring -96 dB RX sensitivity, with 512 kB Flash memory, 64 kB RAM, and an NFC - A tag for “Touch-to-Pair” operations. When launched, the SoC was the world’s highest performance single-chip Bluetooth low energy solution, delivering up to 60 percent more generic processing power, offering 10 times the Floating Point performance, and twice the DSP performance compared to competing solutions. It has been engineered to minimize power consumption with features such as the 2.4 GHz radio’s 5.5mA peak RX/TX currents and a fully-automatic power management system that reduces power consumption by up to 80 percent compared with Nordic’s nRF51 Series SoCs. The result is a Bluetooth low energy solution which offers 58 CoreMark/mA, up to twice as power efficient as competing devices.
The EYSHSNZWZ Bluetooth low energy module will be available in commercial quantities from May 2017.
