Skyworks Solutions, Inc. an innovator of high performance analog semiconductors enabling a broad range of end markets, today announced that several leading OEMs and smartphone providers are leveraging the company’s highly customizable, fully optimized SkyOne™ front-end solution. The SkyOne™ platform, which integrates all RF and analog content between the transceiver and antenna, reduces complexity, size and time-to-market for customers with demanding architectures for advanced mobile applications.
Utilizing Skyworks’ full technology portfolio and advanced multichip module capabilities including proprietary shielding and packaging, SkyOne™ is the world’s first semiconductor device to condense multiband power amplifiers and high throw switches along with all associated filtering, duplexing and control functionality into a single, ultra-compact package--all in less than half the area of the industry’s most advanced approach. At the same time, this groundbreaking solution provides the world’s best linearity and power added efficiency for smart RF integration. As a result, SkyOne™ offers smartphone, tablet and ultrabook OEMs improved efficiency, drastically reduced RF paths, ease of implementation and a scalable platform as bands increasingly proliferate worldwide.
“Consumer demand for increasingly thinner mobile platforms with increased talk and data access time is creating unprecedented analog and RF complexity as well as harmonic coexistence issues. Skyworks is delighted to solve this system challenge with our breakthrough SkyOne™ platform,” said Liam K. Griffin, executive vice president and corporate general manager at Skyworks. “SkyOne™ is a proven architecture that optimizes performance beyond what is possible with existing approaches and incorporates all 2G, 3G and 4G/LTE protocols enabling seamless global roaming and extended battery life. Incorporating Skyworks’ arsenal of tested and patented technologies and leveraging GaAs, SOI, SiGe and CMOS processes, SkyOne™ can be modulated and customized depending upon the system requirements and roadmaps of each OEM.”
About the SkyOne™ Platform
SkyOne™ solutions incorporate the field proven SKY77619, Skyworks’ high efficiency, multimode power amplifier module already in volume production with multiple customers. Further, the highly flexible solution contains a common footprint that can be implemented by all of the world’s carriers and in various regions. Skyworks will be sampling third generation solutions next month and is already developing fifth generation architectures with multiple OEMs.
Specific SkyOne™ Devices
Sampling now, these second generation, hybrid, multimode, multiband, patented front-end modules with low insertion loss support 2.5/3G/4G handsets and operate efficiently in quad-band GSM, GPRS, EDGE, WCDMA, HSPA and LTE modes. The ultra compact, 7 x 9.8 x 1.05 millimeter packaged FEMs consist of a GSM800/EGSM900 power amplifier block (PA), a DCS1800/PCS1900 PA block, separate WCDMA blocks operating in the low and high bands, logic control block for multiple power control levels as well as band-enable functions in cellular and universal mobile telecommunications system. Radio frequency I/O ports are internally matched to minimize external components while extremely low leakage current maximizes handset standby time. The InGaP/GaAs die and passive components are mounted on a multi-layer laminate substrate and the assembly encapsulated in plastic overmold.
SKY78010 (Bands I, II, IV, V, VIII)
SKY78011 (Bands I, II, III, V, VIII)
Skyworks will be showcasing its product portfolio in Hall 6, Booth E24 (6E24) at Mobile World Congress being held February 25 – 28, 2013.
