ANSYS has released the updated version of its Pervasive Engineering Simulation software, ANSYS 19.2. The new release, according to ANSYS, enables customers to solve their most difficult product development challenges faster than ever.
With product lifecycles continuing to shrink and trends in additive manufacturing, autonomous vehicles, electrification and 5G connectivity rapidly evolving, the pressure for companies to deliver innovative products is at an all-time high. The latest release of ANSYS Pervasive Engineering Simulation solutions empowers more users to accelerate the design process with its new single window, efficient workflows and patent-pending advanced meshing technology for computational fluid dynamics (CFD). Users will greatly benefit from new processes for developing embedded software for safety-critical applications, dramatic computational speed and user experience improvements for solving automotive radar scenarios, digital twins, 3D design exploration and structural modeling.
Customers are faced with unrelenting pressure to reduce costs, improve quality and lower cycle times all while producing faster, smarter and more innovative products. ANSYS 19.2 delivers product enhancements across industry-leading portfolio, enabling more companies to remove design barriers and bring their innovative products to market faster than ever without sacrificing quality.
Highlights of the 19.2 Release Include:
Accelerate CFD Models Faster and with More Accuracy
In the fluids suite, ANSYS 19.2 delivers new features to accelerate CFD simulations to boost productivity. The task-based workflow for watertight geometries supports patent-pending Mosaic meshing technology – empowering more engineers to get accurate results faster and with less training. ANSYS Fluent Meshing now includes a fully automated, patent-pending technology that delivers higher quality results at faster speeds. This Mosaic technology automatically combines a variety of boundary layer meshes using high-quality polyhedral meshes for accurate flow resolution for fewer, better quality cells and delivers solutions 2x faster.
Increased Speed and Performance for Multiphysics Designs
ANSYS 19.2 introduces System Coupling 2.0 for multiphysics simulation. It offers improved and consistent performance for any scenario and is fully validated against the original version of the engine. Users can take advantage of the high-performance computing (HPC) resources for multiphysics simulations and quickly map data. Also available in 19.2 is improved text-driven workflows. Users will benefit from refined text-driven workflows that will make it easier to start and restart coupled fluid structure interaction analysis and leverage HPC clusters.
Expanded Capabilities to Perform Functional Safety Analysis for Automotive Semiconductors
Engineers will benefit from the new functionality to improve workflow and speed up the development process for semiconductor manufacturers, specifically those used in the automotive and autonomous vehicle industries with dedicated ISO 26262 support to meet safety regulations, through the newly released medini analyze for semiconductors solutions.
Expanded Systems Simulation Capabilities for Autonomous and Electric Vehicles
The ANSYS systems suite has new features and functionalities that are essential for the development of digital twins, autonomous and electric vehicles. New capabilities make it easier and faster to build, validate and deploy digital twins. Now users can visualize 3D fields of static ROMs and view simulation results, like velocity and flow rate, on the 3D geometry.
With the recent acquisition of OPTIS, ANSYS is introducing ANSYS VRXPERIENCE. This new solution takes predictive validation of vehicle systems to the next level – meeting any virtual reality simulation and validation need for autonomous vehicle simulation, including complex systems such as intelligent headlamps, interior and exterior lighting, autonomous vehicles controls and HMI validation. VRXPERIENCE also enables users to fully and realistically simulate autonomous vehicles using real-world conditions, including various weather and road conditions, oncoming vehicles, pedestrian scenarios and anticipating the vehicle's reaction to any critical situation.
Ease of Use and Enhancements for Embedded Software Designs
In the embedded software suite, new powerful capabilities will make it easier and faster for engineers to design their embedded system architecture and develop and verify safety-critical embedded code. ANSYS SCADE Suite has improvements to both the design verifier and the Simulink importer. ANSYS SCADE LifeCycle now offers Jama from Jama Software to ANSYS' supported requirements manageability tools. Now, users can export SCADE artifacts as surrogate models in Jama, enabling bidirectional generation of matrices.
Physics Simulation Capabilities Expanded to Optics and Optoelectronics
ANSYS 19.2 also introduces a new product bundle, ANSYS SPEOS, a complete solution for designing and simulating illumination, interior and exterior lighting, cameras and LiDARs and optical performance. It helps users design optical systems faster than ever. Now, designers can uniquely simulate optical performance within a system and evaluate and test the final illumination effect. These unparalleled capabilities empower designers to perfect their optical product performance while simultaneously reducing development time and costs.
Enhanced Design Exploration for Faster Insight
In the 3D design suite, designers can confidently explore more concepts faster than ever before. The Discovery family of products has been enhanced to simplify and streamline 3D simulation. ANSYS Discovery Live now includes a parameter studies capability, scripting and customization features – empowering users to make complex design changes easier. The parameter studies empower designers to test new ideas with minimal setup and run time, learn more about simulation results and better understand the trends and trade-offs between design goals. Enhancements to ANSYS Discovery AIM include improved physics-aware meshing that will empower designers to make critical, upfront design choices faster.
More Simulation Options for Design Optimization
ANSYS 19.2 delivers advanced capabilities in the structural suite. New enhanced inverse analysis, material designer and topology optimization developments give engineers more simulation options than ever before. New hot to cold, or inverse, analysis enables engineers to calculate the cold, or unloaded, the shape of a component to achieve the desired hot shape and performance during operation. The new material designer feature can create detailed models of sample materials and then calculate equivalent properties for use in larger scale simulations, providing an efficient way of incorporating complex materials without the overhead. ANSYS19.2 additive solutions provide improved robustness for both ANSYS Additive Print and ANSYS Workbench Additive. Additive Suite now includes physics-driven lattice optimization. In topology optimization, ANSYS 19.2 has additional loading options; manufacturing constraints that are ideal for additive manufacturing; and a unique lattice optimization capability.
Easy, Fast Simulation for Electronics Design
Engineers will greatly benefit from the new analysis capabilities in the electromagnetic suite. New advancements in multi-channel radar system simulation include lightweight geometry modeler that enables rapid meshing and efficient actor movement in pulse-by-pulse road scene simulation resulting in 20x faster processing than the previous release. ANSYS Icepak adds the ability to compute thermal impact from multiple electromagnetic loss connections. A new stackup wizard has been added to ANSYS SIwave that allows for easy definition and exploration of printed circuit board (PCB) stackup layers and impedances to evaluate PCB design performance.
