GLOBALFOUNDRIES at its annual Global Technology Conference (GTC) has announced the production qualification of its mobile-optimized 8SW 300mm RF SOI technology platform. Several clients are currently working with them on this RF SOI process, tailored to accommodate aggressive LTE and Sub-6 GHz standards for front-end module (FEM) applications, including 5G IoT, mobile devices and wireless communication.
Leveraging the 300mm RF SOI process, 8SW delivers significant performance, integration and area advantages with up to 70 percent power reduction and 20 percent smaller overall die size compared to the previous generation. The technology enables superior LNAs (low-noise amplifiers) switches and tuners by supplying higher voltage handling and a best-in-class on-resistance (Ron) and off-capacitance (Coff) for reduced insertion loss with high isolation.
The optimized RF FEM platform helps designers develop solutions that enable extremely fast downloads, higher quality connections and reliable data connectivity for today’s 4G/LTE Advanced operating frequencies and future sub-6GHz 5G mobile and wireless communication applications. GF has now delivered more than 40 billion RF SOI chips for the world’s smart devices, and this latest generation of RF SOI technology is another proof point that they’re poised to meet accelerating global demand for solutions that deliver seamless, reliable data connectivity everywhere. The mobile market continues to favor RF SOI, and GF’s industry leading, 8SW process in 300 mm manufacturing is specifically designed to help clients take advantage of more frequency bands that will deliver ultra-reliable communications across high-band LTE and future 5G applications.
8SW is based on GF’s 300mm production line at Fab 10 in East Fishkill, N.Y., enabling clients to take advantage of advanced tooling and processes for faster time-to-market with industry-leading RF SOI. Qualified process design kits are now available.
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