MACOM to Showcase Industry’s First X-Band Core Chip at the EuMW 2013

M/A-COM Technology Solutions Inc. (“MACOM”) will showcase a broad portfolio of new products for aerospace, defense and network applications, and present a technical paper during European Microwave Week in Nuremberg, Germany, October 6-11, 2013. Event attendees can visit MACOM at booth #169.

Visit MACOM’s booth to learn more about:

  • Highest power GaN in Plastic-packaged power transistors
  • Integrated GaN modules for the L- and S- frequency bands
  • Industry’s first X Band core chipset
  • Highest power E-Band MMIC power amplifier
  • Lowest power EML driver for 100G optoelectronics applications
  • Linear amplifiers for 13/15/18 GHz cellular backhaul
  • Broad catalog of 2000+ reliable standard products

Paper Presentation:

Macom will also be presenting a paper at the EuMW Event on Monday, October 7 at the EuMIC, St. Petersburg Conference Room, NCC Nuremberg, Germany from 9:50AM -10:10 AM. The topic being - Meeting the need for low cost integrated solutions with E/D PHEMT.

Publisher: everything RF

MACOM

  • Country: United States
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