MACOM Showcasing Industry’s First Highly Integrated, Plastic-packaged Control MMIC for Radar Applications at IRSI-13

This year at the International Radar Symposium India 2013 (IRSI-13), MACOM will be showcasing a broad range of products for for aerospace, defense and network applications. In addition, MACOM executives will be presenting both a plenary talk and an industrial paper presentation during the event, which will take place in Bangalore, December 12-14, 2013.

Speak with MACOM experts to solve your unique application design challenges.
 

Visit Booth #A4 to learn more about the company’s:

- Highest power GaN in Plastic-packaged power transistors

- Integrated GaN modules for L- and S-frequency bands

Industry’s first highly integrated, plastic-packaged control MMIC for radar applications

Broad catalog of 2000+ reliable standard products

Plenary Talk:
MACOM’s Director of Engineering Damian McCann will present a paper, “Deploying COTS GaN and SMT Laminate Module Technology to Traditional and Latest Phased Array Radar Applications. ”

Date: Thursday, December 12

Place: IRSI-13 NIMHANS Convention Centre, Bangalore – HALL A

Time: 15:00 – 15:30

Industrial Paper Presentation:
Akilan Krishnan, Manager Field Application Engineering, MACOM, India, will present a paper, “Packaged Chipsets for Next Generation X Band Phased Array Radars.”

Date: Friday, December 13

Place: IRSI-13 NIMHANS Convention Centre, Bangalore – HALL A

Time: 12:35 - 13:00

Publisher: everything RF
Tags:-   Radar

MACOM

  • Country: United States
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