StratEdge Corporation, a provider of high-power semiconductor packages for RF and digital devices, has confirmed its participation in the upcoming EuMW 2019 event in Paris from 1-3 October. At their booth, StratEdge technical experts will be available to discuss the best types of packaging and assembly services for devices from DC to 63+ GHz.
StratEdge designs, manufactures, and provides assembly services for RF and microwave packages with applications in the telecom, VSAT, broadband wireless, satellite, military, test and measurement, automotive, clean energy, and down-hole markets. These hermetic packages have ultra-low losses over wide frequencies. Their high-reliability designs have high thermal conductivity and 50 Ohm impedance transitions. StratEdge packages have even been used on Mars - they powered communications in the first Mars Rover, and are now functioning in the second-generation Mars Rover.
The company not only makes the packages, but provides complete assembly and lidding services. Assembly is done in StratEdge’s new ISO 9001:2015 facility that contains a Class 1000 cleanroom and Class 100 work area with workstations for performing sensitive operations. Assembly services cover manual to fully automatic wire and die bonding, using high-speed wire or ribbon wedge bonding and a proprietary eutectic die attach technology. StratEdge has expertise in microwave and RF devices and has been manufacturing in California since 1999.
According to Casey Krawiec, VP global sales for StratEdge, working with compound semiconductors, such as gallium nitride, requires a package that can best dissipate the heat from the device while ensuring that the device is performing at its optimum potential. Although the package plays the most critical part, the way the chip is packaged can also make a significant difference in the device’s performance. Visitors attending the event can stop at StratEdge’s booths and further discuss this capability. They will also be present at IMAPS 2019 in Boston.
Click here for more highlights from EuMW 2019 in Paris.
