Skyworks has launched a number of wireless networking products incorporating flip-chip packaging. These new devices leverage innovative and proprietary manufacturing techniques that allow smartphone and tablet OEMs to incorporate smaller, thinner solutions for 802.11ac system-in-package (SiP) modules. As high-end mobile devices deliver ever-increasing functionality and ubiquitous connectivity, reducing the front-end circuit board footprint is critical as system providers seek high performance, highly flexible solutions for next-generation platforms.
Flip chip is a type of surface mountable packaging technology that reduces footprint and thickness (compared to conventional packaging), weighs less, is easy to assemble, lowers production costs and improves electrical and thermal performance. Flip-chip solutions combine the strengths of various packaging techniques, such as the size and performance advantage of bare die assembly with the reliability of encapsulated devices which can also be fully RF tested at die level. Their significant size and weight reduction makes them ideal for use in a variety of mobile devices including smartphones and tablets.
The first two products from this product range are:
SKY85202-11: A SP3T Switch with an integrated LNA for 2.4 GHz, 802.11ac modules
SKY85606-11: a SPDT Switch with an integrated LNA for 5 GHz, 802.11ac modules
Both devices are highly integrated and feature an LNA with bypass mode, low loss RF switch and DC blocking capacitors in a single, compact flip-chip package. In addition, these Skyworks Green™ products are compliant with all applicable legislation and are halogen-free.
Additional products in this portfolio will be released later this year.
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