The AG57xQ Series from Quectel are Sub-6 GHz Automotive Modules that are designed for 5G and C-V2X/DSDA applications. They are based on the AEC-Q100 qualified Qualcomm SA515M chipset and are compliant with IATF 16949 and automotive quality processes such as APQP and PPAP. These modules adopt the 3GPP Rel-15 technology and support both 5GNR NSA and SA modes with 4G/3G/2G fallback. They support MIMO technology and utilize multiple antennas at the transmitting and receiving ends in the same frequency band simultaneously to reduce errors and optimize data speeds. These modules provide automotive OEMs and tier-1 suppliers with secure and reliable connected car solutions, and vehicle manufacturers with smart and flexible solutions to build self-driving cars.
The AG57xQ Series of automotive modules support multi-constellation GNSS (GPS, GLONASS, BDS, Galileo, QZSS) based on Qualcomm® IZat™ location technology Gen9VT Lite. They can also support dual-frequency GNSS, PPE (RTK), and QDR 3.0 integrated navigation solutions which greatly simplify product design and enable quicker, more accurate, and more dependable positioning. These modules support downlink data rates of up to 2.4 Gbps and 550 Mbps uplink data rates at 5G NSA mode. They are available in LGA modules that measure 54.50 x 53.00 x 3.45 mm and provide excellent performance in ESD and EMI protection which ensures great robustness in harsh environments.
These automotive modules are suitable for use in telematics boxes (T-Box), telematics control units (TCU), advanced driver-assistance systems (ADAS), C-V2X (V2V, V2I, V2P) systems, on-board units (OBU), roadside units (RSU), and other automotive/traffic systems.
