SE250B4 Series

Cellular Module by Telit Communications (64 more products)

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SE250B4 Series Image

The SE250B4 Series from Telit are LTE Cat 4, Wi-Fi and Bluetooth Modules that support LTE-FDD Cat 4, Wi-Fi IEEE 802.11a/b/g/n/ag, and BLE 5.0 connectivity. They are based on the Qualcomm quad-core ARM Cortex-A53 64-bit processor with a built-in Adreno 702 GPU that enables high data rates, multimedia functions, and edge computing capabilities. These modules have an embedded GNSS receiver that supports GPS, GLONASS, Beidou, and Galileo constellations. They include support for Rx diversity, MIMO DL 2x2, VoLTE & Android 11/12/13/14 that allows easy, flexible, and streamlined application development. These modules are available in different variants for use in North America (SE250B4-NA), Europe (SE250B4-EU), and worldwide applications (SE250B4-WE).

The SE250B4 Series modules deliver maximum data rates of up to 150 Mbps (downlink) and 50 Mbps (uplink) over the LTE network. They require a DC supply of 3.8 V and provide interfaces to easily connect to displays, cameras, and various sensors. These modules are available in LGA packages that measure 41 x 43 mm and are ideal for industrial, consumer, IoT smart devices, and multimedia applications.

Product Specifications

Product Details

  • Part Number
    SE250B4 Series
  • Manufacturer
    Telit Communications
  • Description
    LTE Cat 4/Wi-Fi/BLE 5.0 Modules for IoT and Multimedia Applications

General Parameters

  • Application
    IoT Applications
  • Region
    EMEA, Global, NAFTA
  • Fallback
    2G, 3G
  • GNSS Integrated
    Yes
  • GNSS Standard
    GPS, Beidou, GLONASS and Galileo
  • Cellular Standards
    LTE Cat 4
  • IoT
    Yes
  • Package
    LGA
  • Generation
    2G, 3G, 4G/LTE
  • Interface
    USB 3.1, UART, SPI, I2C, LCM, CSI, SDIO 3.0, GPIOs, RTC
  • Datarate Download Link
    LTE FDD: Up to 150 Mbps, LTE TDD: Up to 130 Mbps
  • Datarate Uplink
    LTE FDD: Up to 50 Mbps, LTE TDD: Up to 30 Mbps
  • Integrated Features
    Bluetooth v5.0, GNSS, Wi-Fi
  • Voltage
    3.5 to 4.4 V
  • Size
    41 x 43 mm
  • Operating Temperature
    -30° C to +75° C
  • Package Type
    Surface Mount
  • ROHS
    Yes
  • Processor
    Qualcomm® quad-core ARM® Cortex®- A53 64-bit

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