TerraGreen 400G2

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TerraGreen 400G2 Image

The TerraGreen® 400G2 from Isola is a Laminate Material that supports ultra-high speed signal propagation with extremely low loss. It utilizes Isola’s novel resin system, ultra-smooth HVLP3(VLP1) copper foil, and 2nd-generation Ultra Low Dk glass, which has been engineered for very high data rates of more than 100 Gb/s. The resin system has proven superior CAF performance on tight pitch testing. CAF performance is enhanced by the resin systems' excellent interlaminar and bond line adhesion strength. It meets the UL94 V-0 standard for flammability and can be processed utilizing standard PCB equipment and processing steps.

The TerraGreen® 400G2 is FR-4 process compatible with low moisture absorption and a pitch capability of 0.8 mm. It can withstand multiple lamination cycles and is compatible with HDI technology. This halogen-free laminate has a glass transition temperature (Tg) of 215°C (by DMA), a thermal conductivity of 0.54 W/m·K, a permittivity (Dk) of 3.10 (at 10 GHz) and a loss tangent (Df) of 0.0015. It is ideal for use in 5G infrastructure, data center systems, high-end computing, wired/wireless communications and AI applications.

Product Specifications

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Product Details

  • Part Number
    TerraGreen 400G2
  • Manufacturer
    Isola Group
  • Description
    High-Speed, Low-Loss Laminate for 5G/High-end Computing Applications

General Parameters

  • Dk (Dielectric Constant)
    3.10
  • Df (Dissipation Factor)
    0.0015
  • Td
    380 Degrees C
  • Tg
    200 Degrees C
  • CTE x-y
    12 ppm/°C
  • CTE z
    2.8%
  • Applications
    5G, Aerospace & Defense, Networking & Communication, Automotive and Transportation
  • Electrical Strength
    67 (1700) kV/mm (V/mil)
  • Peel Strength
    0.7 (4.1) N/mm (lb/inch)
  • Surface Resistivity
    2.0x10^7 MOhms
  • Arc Resistance
    180 Seconds
  • Dielectric Breakdown
    70 kV
  • Note
    Relative Thermal Index (RTI): 140 Degree C ; Time to Delaminate (by TM):60 Minutes

Technical Documents