The Anteo™ from Rogers Corporation are Laminates that are based on glass reinforced hydrocarbon thermoset platform. They are designed with a dielectric constant (Dk) to match that of FR-4 and offer a more cost-effective solution while retaining the tight Dk and thickness tolerances required to cater to wireless market. These laminates are designed to be fabricated using standard epoxy/glass (FR-4) processes which align with conventional bond plies. The Anteo™ laminates utilize RoHS-compliant flame-retardant technology to achieve a UL 94 V-0 flame-retardant rating. They are also compatible with lead-free solder processes and adhere to the requirements of IPC-4103B, slash sheet/250 with compliance to industry standards.
The Anteo™ laminates have a dielectric constant (Dk) of 4.38 (at 2.5 GHz), a dissipation factor of 0.005 (@10 GHz/23°C), and Td of 414°C. They have a thermal coefficient of dielectric constant of -21 ppm/°C and a thermal conductivity of 0.64 W/m.K These laminates are available in standard thicknesses of 20, 30, 40, 60, 90, and 120 mil.
