RO3003

Note : Your request will be directed to Rogers Corporation.

RO3003 Image

The RO3003 from Rogers Corporation is a Ceramic-filled PTFE based Laminate that can be used for RF & Microwave applications up to 40 GHz. The laminate has a dielectric constant of 3 (8-40 GHz) and provides exceptional plated through-hole reliability, even in severe thermal environments. It exhibits a coefficient of thermal expansion (CTE) of 17 ppm/degree C on the X and Y axis and 24 ppm/degree C on the Z-axis. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage (after etch and bake) of less than 0.5 mils per inch.

The laminate is fabricated into printed circuit boards using the standard PTFE circuit board processing techniques and is suitable for use with epoxy glass multilayer board hybrid designs. It is ideal for global positioning satellite antennas, cellular telecommunications systems, power amplifiers and antennas, patch antenna for wireless communications, direct broadcast satellites, datalink on cable systems, remote meter readers, power backplanes, and automotive radar applications.

Product Specifications

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Product Details

  • Part Number
    RO3003
  • Manufacturer
    Rogers Corporation
  • Description
    Ceramic-filled PTFE based Laminate for RF & Microwave Applications up to 40 GHz

General Parameters

  • Dk (Dielectric Constant)
    3
  • Df (Dissipation Factor)
    0.0010
  • Td
    500 °C
  • Thickness
    0.13 to 1.52 mm
  • Frequency
    8 to 40 GHz
  • Applications
    Power backplanes, Remote meter readers
  • Flamibility
    V-0
  • Grade
    Commercial
  • Industry Application
    Automotive, Radar, Telecommunication, GPS
  • Moisture_Absorbtion
    0.04 %
  • Peel Strength
    12.7 lb/in
  • Size
    12 x 18 Inches (305 x 457 mm) / 24 x 18 Inches (610 x 457 mm)
  • Surface Resistivity
    (10)7 Mohm
  • Type
    Ceramic-filled PTFE
  • Volume Resistivity
    (10)7 Mohm-cm
  • Dimensional Stability
    -0.06 to 0.07 mm/m
  • Tensile Modulus
    823 to 930 MPa
  • Thermal Coeffecient
    -3 ppm/°C
  • Thermal Conductivity
    0.50 W/m/K

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