The SUMMIT200 from FormFactor is a 200 mm Semi/Fully-Automated Probe System for conducting high-accuracy measurements on single or volume wafers. It enables precision electrical measurements over temperature for ultra-low noise, DC, RF, mmWave, and THz applications, with the manual, semi-automatic, and fully-automatic operation. This advanced probe system uses PureLine™ technology to achieve very low noise levels and the patented AttoGuard® and MicroChamber® technologies to improve low-leakage and low-capacitance measurements. It has an advanced 200 mm fast stage with an advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact.
With a cassette handling capacity of up to 50 wafers, high throughput test features, and a wide temperature range of -60°C to +300°C, this system is ideal for scientists, engineers, and production operators in R&D, device characterization and modeling or niche production applications. It offers wide upgrade paths to meet any future needs and provides a fast, high-accuracy, and high-volume measurement platform for existing and future devices and ICs.
The SUMMIT200 supports Contact Intelligence™ which is a unique technology that ensures proper wafer contact. It uses a powerful combination of innovative system design and state-of-the-art image processing to provide an operator-independent solution to achieve highly-reliable measurement data. This probe system allows thermally induced drift to be automatically corrected to enable automated temperature transitions over the full temperature range using VueTrack or ReAlign (the effective temperature range and minimum obtainable pad size depend on the probe card and probe card holder or positioner used).
