C04-003

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C04-003 Image

The C04-003 from Microchip Technology is a RF Package with Terminal Count 16, Lead Pin Thickness 0.008 to 0.015 Inches, Lead Pitch 0.100 Inches. Tags: C-DIP. More details for C04-003 can be seen below.

Product Specifications

Product Details

  • Part Number
    C04-003
  • Manufacturer
    Microchip Technology
  • Description
    16-Lead Ceramic Dual In-Line

General Parameters

  • Terminal Count
    16
  • Lead Pin Thickness
    0.008 to 0.015 Inches
  • Lead Pitch
    0.100 Inches
  • Mounting
    Drop-In
  • Package Size
    0.300 Inches
  • Type
    C-DIP

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