C04-006

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C04-006 Image

The C04-006 from Microchip Technology is a RF Package with Terminal Count 28, Lead Pin Thickness 0.008 to 0.014 Inches, Lead Pitch 0.100 Inches. Tags: C-DIP. More details for C04-006 can be seen below.

Product Specifications

Product Details

  • Part Number
    C04-006
  • Manufacturer
    Microchip Technology
  • Description
    28-Lead Ceramic DIP Dual In-Line

General Parameters

  • Terminal Count
    28
  • Lead Pin Thickness
    0.008 to 0.014 Inches
  • Lead Pitch
    0.100 Inches
  • Mounting
    Drop-In
  • Package Size
    0.600 Inches
  • Type
    C-DIP

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