C04-25172

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C04-25172 Image

The C04-25172 from Microchip Technology is a RF Package with Terminal Count 780, Lead Pitch 1 mm, Package Thickness 0.58 mm. Tags: BGA. More details for C04-25172 can be seen below.

Product Specifications

Product Details

  • Part Number
    C04-25172
  • Manufacturer
    Microchip Technology
  • Description
    780-Ball Plastic Ball Grid Array Package

General Parameters

  • Terminal Count
    780
  • Lead Pitch
    1 mm
  • Mounting
    Surface Mount
  • Package Size
    29 x 29 x 2.21 mm
  • Package Thickness
    0.58 mm
  • Type
    BGA

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