C04-25443

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C04-25443 Image

The C04-25443 from Microchip Technology is a RF Package with Terminal Count 1221, Lead Pitch 0.80 mm, Package Thickness 1.37 mm. Tags: BGA. More details for C04-25443 can be seen below.

Product Specifications

Product Details

  • Part Number
    C04-25443
  • Manufacturer
    Microchip Technology
  • Description
    1221-Ball Thick Ball Grid Array

General Parameters

  • Terminal Count
    1221
  • Lead Pitch
    0.80 mm
  • Mounting
    Surface Mount
  • Package Size
    29 x 29 x 3.57 mm
  • Package Thickness
    1.37 mm
  • Type
    BGA

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