C04-25515

Note : Your request will be directed to Microchip Technology.

C04-25515 Image

The C04-25515 from Microchip Technology is a RF Package with Terminal Count 1517, Lead Pitch 1 mm, Package Thickness 1.33 mm. Tags: BGA. More details for C04-25515 can be seen below.

Product Specifications

Product Details

  • Part Number
    C04-25515
  • Manufacturer
    Microchip Technology
  • Description
    1517-Ball Thick Ball Grid Array (JXC

General Parameters

  • Terminal Count
    1517
  • Lead Pitch
    1 mm
  • Mounting
    Surface Mount
  • Package Size
    40 x 40 x 4.03 mm
  • Package Thickness
    1.33 mm
  • Type
    BGA

Technical Documents

Latest RF Packages

View more products