CYW43022

Wireless Chipset by Infineon Technologies (15 more products)

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CYW43022 Image

The AIROC CYW43022 from Infineon Technologies is a 1x1 2.4/5 GHz Wi-Fi 5 (802.11ac) + Bluetooth 5.4 Combo Chip. It has been designed for IoT designs that require minimal power consumption and compact size. This combo chip is built on market-proven wireless IP to ensure maximum interoperability and supports concurrent Wi-Fi and Bluetooth connectivity use cases and co-existence. It includes embedded Bluetooth stack and Wi-Fi networking off-loads to save system-level power by handling Bluetooth and Wi-Fi connectivity activities, without the involvement of a host processor.

The CYW43022 has a built-in power amplifier (PA) and low noise amplifier (LNA) switch to support a single antenna shared between Wi-Fi and Bluetooth. It also has an option for an internal 32 kHz low-power oscillator that saves power and bill of materials (BOM) costs. This combo chip integrates SDIO v2.0/v3.0 host interface, SPI host interface, HCI over UART/SPI for Bluetooth communication, and 40 GPIOs for internal connectivity options. It enables Wi-Fi software for RTOS, Linux, and Android designs with support from multiple hosts, reducing the development time.

This chip delivers a transmit power of +18 dBm with a data rate of up to 78 Mbps over the channel bandwidth of 20 MHz. It is available in a wafer-level chip scale package that measures 3.76 x 4.43 mm and is ideal for smart home, smart medical, healthcare, and wearable applications.

Product Specifications

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Product Details

  • Part Number
    CYW43022
  • Manufacturer
    Infineon Technologies
  • Description
    2.4/5 GHz 1x1 Dual-Band Wi-Fi 5 + Bluetooth 5.4 Combo Chip

General Parameters

  • Application
    IoT, Smart home, Wearables, Smart Medical/Healthcare
  • Technology
    WiFi + Bluetooth
  • Bluetooth Standard
    Bluetooth V5.4
  • Bluetooth Low Energy
    Yes
  • WiFi Standard
    802.11ac
  • WiFi Band
    2.4 / 5 GHz
  • Data Rate
    Up to 78 Mbps
  • Output Power
    18 to 20 dBm
  • Interface
    UART, SPI, SDIO, GPIO
  • MIMO
    Yes
  • Dimension
    106-ball WLBGA (3.76 x 4.43mm 0.35mm pitch), 251-pin WLCSP (3.76 x 4.43, 0.2mm pitch)
  • Package
    Surface Mount
  • Operating Temperature
    -20 to +70 Degree C

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