The AIROC CYW5551x from Infineon Technologies are 1x1 Wi-Fi 6/6E (802.11ax) + Bluetooth 5.4 Combo Chips. They provide robust connections, extended range, power savings, low latency, and device synchronization in IoT, smart home, and smart wearable devices. These chips offer excellent performance for Wi-Fi 6/6E requirements while maintaining a cost-effective balance of Wi-Fi 6/6E features and Bluetooth/BLE performance and power efficiency. They provide an optimal design to speed up time-to-market and are tuned to deliver the desired performance over a wide temperature range.
The CYW5551x combo chips feature ER-PPDU, longer guard intervals, and long OFDM symbols with DCM modulation for robust coverage. They support the target wake time (TWT) algorithm to optimally control the amount of power consumed by each component, thereby reducing power consumption compared to existing devices. These chips can work in the 6 GHz band for lower latency by using the ‘greenfield’ spectrum. They operate either in hosted or embedded mode and are optimized in range and power to deliver high efficiency in a small, highly integrated solution. These chips have a fully validated Bluetooth stack and include a sample code to accelerate the development time.
The AIROC CYW5551x chips integrate a multi-layer security function to improve security for various threats in an IoT environment and have built-in PSA level 1-certified Arm trust zone crypto-cell 312 modules. They are ideal for medical/healthcare, wearables, and smart home: thermostats, speakers, printers, IP cameras, video doorbells, door locks, battery-powered equipment, industrial IoT, and other small form-factor, battery-powered IoT applications.
