The CYW55573 from Infineon is a 2.4, 5, and 6 GHz Wi-Fi 6/6E and Bluetooth 5.3 Combo SoC. It delivers a PHY data rate of up to 1.2 Gbps (Wi-Fi) and has Bluetooth transmitting options of 20, 13, or 0 dBm. This SoC supports smart coexistence between Wi-Fi and Bluetooth, or external LTE and 15.4 radio. It has a 2x2 antenna configuration and delivers high-quality video/audio streaming and seamless connectivity experience in congested network environments and significantly reduces latency by operating in the 6 GHz spectrum. This SoC has 20/40/80 MHz channels for Wi-Fi and supports LE audio with Auracast broadcast, LE – 2 Mbps, Long Range, and Advertising Extensions for Bluetooth.
The CYW55573 extends edge AI and IoT device capabilities with robust connections and extended range. It has an STA and Soft AP mode and multi-layer security for the protection of individual subsystems. This SoC can be controlled via PCIe, SDIO (WLAN), UART, I2S, and PCM (Bluetooth) interfaces. It is available in an FCBGA, WLCSP, or WLBGA package with minimal external components to reduce cost and allows for platform design flexibility in size, form, and function. The WLAN and Bluetooth® radios also include on-chip power amplifiers and low-noise amplifiers to further reduce the need for external components.
The CYW55573 is suitable for use in video and audio applications such as wireless speakers, voice assistants, surveillance cameras, home entertainment, video streaming adapters, drones, digital cameras, conference bridges, and gaming consoles. This chip is also suitable for use in commercial and industrial applications such as indoor/warehouse asset tracking hubs, industrial gateways for Wi-Fi and Bluetooth-enabled lights/sensors, base stations for wireless cameras, mobile POS, AI-enabled edge devices, medical imaging machines, security systems, smart city, robots, and mobile gateway applications.
