The 88W8887 from NXP Semiconductors is an integrated SoC for 1x1 802.11ac and Bluetooth 5.0. It has been specifically designed to meet the speed, reliability and quality needs of next-generation applications requiring high performance, while minimizing space and power requirements. The 88W8887 has an integrated front-end which helps in reducing the BOM significantly and simplifies layout design for fast time to market. It includes SDIO 3.0 and high-speed UART interfaces to connect Wi-Fi/Bluetooth applications to the host processor. The SoC is available in both QFN and CSP flip-chip package options and is suitable for use in consumer electronic devices, IoT, connected appliances and mobile routers.
